Paul Hook

Paul Hook has over 20 years of experience in the semiconductor industry, specializing in digital circuit design and physical design engineering. At Qualcomm, from October 2008 to August 2018, Paul served as a Senior Staff Engineer, participating in the tapeout of seven processor cores across five technologies. At ARM, from June 2000 to June 2008, Paul held the position of Senior Design Engineer, focusing on various digital circuit design tasks and processor evaluations. Paul transitioned to Microsoft in January 2023 as a Principal Physical Design Engineer, leading projects for Network-on-Chip macros, and previously worked as a Senior Physical Design Engineer on a custom ARM server CPU core. Paul also consulted for Triangle Quality Solutions as a Physical Design contractor for Qualcomm in mid-2008. Academic credentials include a Master of Science in Electrical Engineering and a Bachelor's degree in Computer Engineering from the University of Michigan, along with a certificate in Analog Circuit Design from Walden University.