Paul Mescher is a Senior Director of IC Packaging Technology and Reliability at Microsoft, a position held since 2013. Previously, Paul worked as a Vice President of Flip Chip Packaging at Amkor Technology from 1995 to 2013 and as a BGA Process Engineer at IBM from 1988 to 1995. Paul earned a Bachelor of Science in Engineering with a focus on Materials Science Engineering from Arizona State University between 1983 and 1988.
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