Timo Henttonen is a highly skilled and experienced technical director specializing in IC packaging with over 20 years in the wireless industry. Currently serving as the Director of IC Packaging / Silicon Development at Microsoft, Timo manages technologies for Microsoft Cloud + AI datacenters, Surface Computers, HoloLens, and XBOX products. Previously, Timo held various roles at Microsoft, leading successful R&D teams and developing innovative packaging technologies for Lumia smartphones and HoloLens. Timo gained foundational experience at Nokia, pioneering advanced packaging solutions and quality improvements while leading global teams.
This person is not in the org chart
This person is not in any teams
This person is not in any offices