Micross Components
Brian Fox is an experienced engineering professional with extensive expertise in process development and control, particularly in hybrid manufacturing. Currently serving as the Director of Process Engineering at Micross Components since June 2021, Brian previously held a prominent role as Principal Process Engineer at Data Device Corporation from December 1987 to April 2021, focusing on research and development of innovative packaging concepts and product designs. Earlier in Brian's career, roles included Telephone Technician/NCOIC in the New York Air National Guard, Equipment Technician at Circuit Technology Incorporated, and Technical Engineer at Aeroflex Laboratories. Brian holds a Bachelor of Business Administration in Organizational Leadership from St. Joseph's University and degrees in Liberal Arts and Electronic Technician from Suffolk County Community College and the Community College of the Air Force, respectively.
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Micross Components
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Micross Components is a leading global provider of specialty electronics solutions for defense, space, medical and demanding industrial industries. As a single-source supplier of advanced high-reliability electronics, Micross Components manufacturer and distribute a wide range of products, including integrated circuit and discrete bare die andwafers; passive components, distinctive devices such as solid state batteries and SiC devices; connectors; standard and custom packaged devices; and a comprehensive list of services spanning assembly, test and mechanical component modifications.