Vincent Buffa

Vince Buffa is currently serving as the Chairman at HDT Global and Micross Components. Vince has extensive experience in the aerospace and defense industry, with previous roles as President & CEO at HDT Global and CEO & President at Data Device Corporation. Additionally, Vince has held leadership positions at companies such as Rexnord, Honeywell, and Smiths Aerospace. Vince holds an MBA in Finance from Hofstra University and a BEEE in electrical engineering from Manhattan College.