Micross Components
Vince Buffa is currently serving as the Chairman at HDT Global and Micross Components. Vince has extensive experience in the aerospace and defense industry, with previous roles as President & CEO at HDT Global and CEO & President at Data Device Corporation. Additionally, Vince has held leadership positions at companies such as Rexnord, Honeywell, and Smiths Aerospace. Vince holds an MBA in Finance from Hofstra University and a BEEE in electrical engineering from Manhattan College.
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Micross Components
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Micross Components is a leading global provider of specialty electronics solutions for defense, space, medical and demanding industrial industries. As a single-source supplier of advanced high-reliability electronics, Micross Components manufacturer and distribute a wide range of products, including integrated circuit and discrete bare die andwafers; passive components, distinctive devices such as solid state batteries and SiC devices; connectors; standard and custom packaged devices; and a comprehensive list of services spanning assembly, test and mechanical component modifications.