Derek Lew

Derek Lew has had an extensive work experience. From 2010 to 2013, they were a Research Assistant and Lab Technician at the UC Berkeley Biomechanics Lab. From 2013 to 2014, they were a Mechanical Engineer at Krypton Vision Inc. From 2014 to 2018, they were a Process Engineer I and II at Cobham Advanced Electronic Solutions - Microelectronics Solutions. From 2018 to 2020, they were a Process Engineer at Velodyne Lidar, Inc., where they designed, prototyped, and implemented reusable fixturing to replace single use sheet metal clip. Currently, they are a Sr. Staff Engineer, NPI at Mojo Vision, responsible for contract manufacturer sourcing, development, and validation of flip chip on board and laser depaneling processes for Flexible Printed Circuit Board. Derek has also conducted validation and FA on FPCB, project managed CMs to tune COB process, and fed back FPCB DFM to internal designers to improve yields by 60%+.

Derek Lew attended the College of San Mateo from 2006 to 2009 and obtained a Bachelor of Science in Mechanical Engineering from the University of California, Berkeley from 2009 to 2011.