John(Haijun) She

John (Haijun) John(Haijun) has worked in the engineering field since 1997. John(Haijun) began their career at Intel Shanghai as a Product and Test Engineer, where they developed and implemented ATE test hardware and software of flash memory. John(Haijun) then moved to Conexant as a Senior Product Engineer, where they analyzed package mechanical, thermal and electrical performance and recommended product marketing team on package selection. In 2003, they joined Atrua Technologies as a Product Engineer, where they defined test methodology and test plans for capacitive finger print devices. John(Haijun) then moved to Synaptics in 2004 as a Test Methodology Developer, where they developed capacitive touch IC test methods on Teradyne J750 systems. In 2007, they joined Gtronix as a Product Engineer and successfully validated and characterized two analog audio noise cancellation devices on the bench. In 2009, they moved to Link-A-Media Device as a Product Engineer and managed a Senior Product Engineer and Senior Test Engineering team for new product introduction. In 2012, they joined InvenSense, Inc. as an Assembly Packaging Engineer and designed and manufactured multiple generations of 3 axis, 6 axis inertial motion sensor in QFN LGA, as well as 7 axis, 9 axis combo sensor with pressure and compass sensor in SIP LGA. In 2018, they joined Mojo Vision Inc. as a New Product Introduction Engineering, where they designed 2-layer flex PCBs with 25um line space for both packaged IC and bumped die, and was in charge of flex vendor selection.

John John(Haijun) attended Shanghai University, where they earned a Bachelor's degree in Physics.