Ken Stiles is a Senior Manager in the Flexible Printed Circuit Segment at Molex, a role held since 2024. Previously, Ken served as a Development Engineer at Molex, focusing on product development for data communications. Ken's background includes experience as an Engineering Supervisor and Manager of Project Engineering at Molex Copper Flex Products. Earlier in their career, Ken participated in Tyco Electronics' rotational engineering program and worked as an Account Manager/On Site Engineer at Molex, providing support to IBM. Ken holds an MBA from the University of Minnesota-Duluth and a BSME from Grove City College.
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