Ming Y.

产品开发 at Moore Threads

Ming Y. has a robust background in hardware design and engineering, currently serving as a Product Development professional at 摩尔线程智能科技(北京)有限责任公司 since April 2021. Prior experience includes a role as a Board System Architect at 英伟达 from December 2017 to April 2021, and as a VR/AR Hardware Architect at Thundercomm for a brief period in 2017. Ming Y. also held significant positions at 英伟达公司 from August 2005 to December 2015, acting as a Board System Engineering Product Manager where responsibilities included managing engineering issues for NVIDIA TESLA products and collaborating across various teams to ensure product quality and timely market release. Earlier experience includes working as an AE/FAE at VIA Technologies, Inc., focusing on schematic design and production support for various VIA chips-based products. Ming Y. earned a Bachelor's degree in Heating, Ventilation and Air Conditions Engineering from Chang'an University in 2000.

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