Teppo Aapro is a Component Platform Specialist at Murata since June 2020, following a role as a Simulation Specialist at Varjo from March to December 2019. Previously, Teppo held various positions at Huawei Technologies from September 2016 to July 2018, including Principal Engineer for Thermal Simulations and Consultant within the Reliability Competence Center. Other significant experience includes serving as a Principal Specialist in Thermal Management at Microsoft from 2014 to August 2016 and a long tenure at Nokia from 1997 to 2014, where roles included Principal Specialist and Research Engineer focusing on thermal design and management solutions for mobile devices and telecom equipment. Teppo holds a Master of Science in Engineering from LUT University, specializing in Heat and Mass Transfer and Fluid Dynamics, and is currently engaged in executive education at Aalto University since 2019.
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