NanoFEA, a startup company, specializes in microelectronics packaging and module design, with a strong focus on reliability prediction for electronic assemblies and components. Our expertise lies in failure mode analysis and optimizing designs. Common assembly failures result from compromised hermetic seals, outgassing from packaging materials, insufficient heat dissipation, structural stress, and fatigue induced by shock and vibration. NanoFEA tackles these packaging reliability challenges by leveraging Nano-scale, thermally conductive materials, dielectric sealants, and gettering materials, supported by Artificial intelligence (AI) assisted finite element analysis (FEA) and computational fluid dynamics (CFD) modeling  and simulation. 


NanoFEA, LLC

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NanoFEA, LLC

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