Nepes corporation, founded in 1990, has been providing bumping and wafer-level package OSAT manufacturing services in partnership with Fabless and IDM customers worldwide since 2001.

Nepes provides turn-key solution of IC back-end service for 8″ and 12″ wafer with reliable quality by implementing mainstream technology from the wafer bumping, IC packaging and testing. The Company’s portfolio of products covers Wafer level package(WLP), System in package(SiP) and Fan-out panel level package(FOPLP). Nepes has manufacturing sites in South Korea, Philippines and China and international sales offices in San Diego, CA, Shanghai, China and Taiwan.

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