Bryant Hou

Bryant Hou is a seasoned thermal design engineer with extensive experience in the technology sector, currently serving as a Staff Thermal Design Engineer at 網件 since November 2019. Prior to this role, Bryant worked as Function Associate Director at 華碩, focusing on thermal design and validation for various product categories including server and workstation motherboards, IPCs, and smart speakers. Previous positions include Thermal Engineer at 技嘉, where liquid cooling validation was a key responsibility, and Technical Project Manager at Pegatron, accumulating over nine years of thermal experience in broadband products. Bryant's career began at 華碩 as an Engineer, quickly transitioning into thermal design roles. Educational qualifications include a Master's Degree in Mechanical Engineering from National Tsing Hua University and a Bachelor's Degree in the same field from Yuan-Ze University.