Howie Ding

Howie Ding is a Senior Principal Engineer at Nexperia, bringing over 8 years of experience in large wire wedge bonding. They possess excellent technical, analytical, and communication skills, demonstrated through their in-depth knowledge of equipment and processes for power discrete and module applications. Previously, Howie worked at ASMPT Hong Kong in various roles, including Senior Process Engineer, from 2014 to 2017. Howie holds a Master of Philosophy (MPhil) in Materials Science and Engineering from The Chinese University of Hong Kong, earned in 2014.