Michael Laufer

Michael Laufer is a highly skilled engineer with extensive experience in high-performance computing (HPC) and thermal engineering. Currently serving as an HPC Performance Engineer and HPC Applications Engineer at NextSilicon since July 2022, Michael previously worked as an HPC Software Engineer at Toga Networks - a Huawei Company, from July 2020 to July 2022. Prior to that, Michael spent six years at Intel Corporation as a Thermal Engineer. Michael holds a Master of Science in Mechanical Engineering from the Technion - Israel Institute of Technology, where studies were completed from January 2016 to August 2021, and a Bachelor's degree in Mechanical Engineering from the same institution, earned between 2012 and 2016.