Alexander Yatskov, PE, Ph.D, is an innovation-driven Principal Thermal/Mechanical/Hardware Engineer with extensive experience in scalable and energy-efficient cooling technology for AI MCM packages. Currently serving as a Principal Thermal/Hardware Development Engineer at Nokia, they have previously held significant roles at Teradyne and Juniper Networks, where they developed advanced cooling systems and contributed to numerous patents. With a rich history of work at Cray Inc. and expertise in high-performance computing and telecommunications, Alexander has also published extensively and been a former engineering professor at Moscow State Technological University. Their educational background includes a Ph.D. in Machine Design from Moscow State University of Technology and a Master's in Engineering Management from Tufts University.
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