Chris Horng

Chris Horng is a Senior Silicon Packaging Engineer at Nokia, specializing in packaging architectures and engineering processes. They have previously held positions at Luminous Computing, Cisco, and TSMC, where they utilized extensive experience in data analysis and visualization to drive improvements in product quality and operational efficiency. Chris obtained a Master of Science in Materials Science & Engineering from the University of California, San Diego, and a Bachelor's degree from the University of Illinois at Urbana-Champaign. They also completed a Data Science bootcamp at the University of California, Berkeley, further enhancing their skill set in data-driven decision-making.