Benjamin Klein is a Principal Process Engineer at Northrop Grumman, where they apply their expertise in mechanical engineering. With experience in the research and development of thin film thermoforming across various industries, Benjamin has a strong background in sputter deposition and galvanic tin plating. They previously worked as a Mechanical Engineer at Tek Pak Inc, overseeing the acquisition and startup of complex product lines. Benjamin holds a Bachelor of Science in Mechanical Engineering from Northwestern University and is currently pursuing studies in Chinese Language at Peking University.
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