Ryan Johnson is a Lead Material Process Engineer at Northrop Grumman Corporation, bringing expertise in materials and process development to creative interdisciplinary teams. Ryan previously worked at Micron Technology as a Package Development Engineer and a Package Development Material Engineer, where they focused on innovative package solutions. Ryan holds a Bachelor of Science in Materials Science and Engineering from Boise State University and a Master of Science in the same field from Washington State University. With a strong history of collaborating with domestic and international partners, Ryan applies statistical approaches and Design of Experiments to achieve efficient, practical results.
Location
Roy, United States
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