Christopher Spegal is a Sr. Package Layout Engineer at Nvidia, where they focus on advanced PCB and packaging design. With a strong background in the automotive and aerospace industries, they have developed expertise in Cadence PCB and package development tools. Christopher previously held roles as a Manufacturing Engineer at Kenworth Truck Co. and as a Sr. IC Packaging and PCB Design Engineer at KBR, Inc. They hold a Master of Science and a Bachelor of Science in Industrial Engineering from Ohio University.
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