Padam Jain

Padam Jain is a Principal Engineer in Silicon Packaging at NVIDIA, with a robust history of experience in development, qualification, and high-volume manufacturing of IC packages for mobile and server applications. Previously, Padam held positions at Google, Broadcom, and Intel, focusing on package architecture, reliability, and project management in a matrix organization. Padam earned a Ph.D. in Materials Science from Brown University and holds certifications as an ASQ Quality Engineer and a Six Sigma Black Belt. Their academic pursuits began with a B.Tech/M.Tech in Metallurgical Engineering from the Indian Institute of Technology, Bombay.