Steven Hsieh is a highly experienced engineering professional specializing in integrated circuit packaging and substrate technology. Currently serving as a Principal Packaging and Substrate Engineer at NVIDIA, Steven focuses on R&D and product development within the Advance Technology Group. Prior experience includes pivotal roles at Microsoft as a Principal Packaging Engineer, where Steven developed advanced substrate technology for AI workloads, and Xilinx, leading the Flip Chip and 2.5D assembly engineering group. Additional positions with Intel Corporation, IDT, and multiple roles at Xilinx have contributed to a strong foundation in package technology development, team leadership, and engineering management. Steven Hsieh holds both a Bachelor of Science and a Master of Science from San José State University.
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