Yeong Lee

Yeong Lee has extensive experience in the electronics and semiconductor industries, currently serving at NVIDIA since 2012 in Assembly and Packaging, managing manufacturing suppliers for Data Center and High Performance Computing products. Prior to NVIDIA, Yeong held the position of Director of Wafer Scale Product and Technology Marketing at STATS ChipPAC from 2010 to 2012, focusing on wafer scale products and embedded wafer level devices. Yeong's career includes leading IC packaging integration at Motorola Mobile Devices from 2004 to 2010, and developing silicone-based electronic materials as a Technology Platform Leader at Dow Corning from 1995 to 2004. Additionally, Yeong worked as a Senior Research Engineer at Dow Chemical and as a Research Fellow at the California Institute of Technology. Academic qualifications include a Ph.D. in Solid Mechanics from Brown University and a Certificate in Product Management from the Haas School of Business, University of California, Berkeley.