Ning D. is a seasoned Senior Principal IC Frontend Backend Integration Engineer at NXP, holding a PMP certification and specializing in project leadership and management since 2005. Expertise includes wafer process technologies, bipolar and BiCMOS systems, advanced CMOS, electronic packaging and assembly, and all aspects of IC frontend and backend integration, with a strong focus on quality and reliability in semiconductor device physics. Previously, Ning D. served as a Development Engineer at Philips from 2000 to 2005, leading development projects in electronic packaging and assembly, and gained substantial knowledge in the reliability of electronic components. Early career experience includes a post-doctoral position at the University of Twente from 1997 to 2000, focusing on piezoelectrics and ferroelectrics. Ning D. earned a PhD in Applied Physics from Universidad Autónoma de Madrid between 1994 and 1997.
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