Feive Lopez is a skilled Package Development Engineer currently working at onsemi since June 2023. Prior to this role, Feive has extensive experience at Texas Instruments from October 2013 to December 2019, serving in multiple positions including Program Manager, Package Design Engineer, and Substrate Design Engineer. Additionally, Feive completed an internship in the Leadframes Process Engineering Department at Excelitas Technologies Corp. in April 2012. Training encompasses failure analysis techniques and manufacturing processes, including dicing, wafer preparation, electrical testing, and packaging. Feive holds a Bachelor of Science degree in Materials Engineering from the College of Engineering at the University of the Philippines Diliman, completed in 2013.
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