Joe Steffler is an experienced professional in advanced packaging design and failure analysis, currently serving as an Advanced Packaging Designer at onsemi since March 2008. In this role, Joe develops innovative circuit modules using the latest packaging techniques and prototypes demonstrator products. Prior to this, Joe worked at ON Semiconductor from June 2004 to March 2008, where responsibilities included package level reliability and failure analysis, as well as providing application support for audiology products. Joe's career began at Cisco/PixStream as an Engineering Support Specialist from March 1999 to April 2001, where crucial support was offered during the development stages of networking units.
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