Rick Lai is currently a Principal Engineer at onsemi, focusing on advanced packaging development for image sensors and innovative packaging solutions. With a decade of experience at ASE Global, Rick managed the development of customized sensor packages and honed project management skills across various cross-functional teams. Previously, Rick held roles ranging from Deputy Manager to Senior Engineer, where responsibilities included marketing report analysis, new package introduction management, and department oversight. Rick earned a Bachelor of Science in Optics and Photonics and a Master of Science from National Central University.
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