Bond Shi is a Technical Supply Base Development Manager at 1.0 (One-Point-Zero), where they focus on supplier sourcing and process development. With around ten years of experience in consumer electronics assembly and a strong background in industrial engineering and production management, Bond has previously held positions at companies such as PCH, Regina Miracle International, and Foxconn. They obtained a Bachelor's degree in Machinery Design/Manufacturing and Automation from Zhengzhou University in 2005. Bond is recognized for their problem-solving skills, teamwork, and proactive communication.
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