Terry Kang currently serves as a Member of Technical Staff at OpenAI since June 2024. Prior experience includes a tenure as Technical Lead & Manager in Advanced Packaging at Google from November 2014 to October 2024, where responsibilities included pioneering packaging technology for production and delivering multiple generations of TPUs, VPUs, and network chip solutions. Previously, Terry worked at NVIDIA from April 2011 to November 2014 as Sr. Manager for Advanced Packaging, focusing on 2.5D Si interposer package development for high-end GPUs. At Tessera, from April 2010 to April 2011, Terry held the position of Sr. Director for 3D & Flip Chip Development Programs, leading teams in advanced flip chip technology while engaging with customers. In earlier experience at Altera from May 2006 to April 2010 as Sr. Member of Technical Staff in Package Engineering, responsibilities included overseeing materials and processes for large die flip chip package development, successfully qualifying packages for high volume production.
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