Osborn Engineering
Chip Branscum, PE, currently serves as the Director of Mechanical Engineering at Osborn Engineering in Cincinnati since April 2024. With extensive experience in engineering management, Chip has held roles such as the Director of Mechanical Engineering at KZF Design and Pinnacle Infotech, where responsibilities included providing technical support and design analysis across various mechanical systems. Previous positions include Director of Engineering at Motz Engineering and RPC Mechanical, Inc., and MEP Leader at CR architecture + design, where Chip established a successful MEP engineering team. Educational qualifications include a Bachelor of Science in Mechanical Engineering from the University of Cincinnati, with an extensive career that began with a design engineer role in 1989.
This person is not in any teams
This person is not in any offices