Lester Lim

Sr. Packaging Engineer At Outform at OUTFORM

Lester Lim is a seasoned packaging professional with extensive experience in structural design and engineering. Currently serving as a Senior Packaging Engineer at OUTFORM since January 2022, Lester has previously held positions at Rapid Displays and Lahlouh, where significant contributions included establishing a structural design department and developing finishing standards. Prior roles include Structural Designer at Premier Mounting & Diecutting and Design Manager at Viking Packaging & Display, where Lester led design teams and crafted custom packaging solutions across various industries. Lester's educational background includes a Bachelor of Science in Industrial Technology with a concentration in Packaging from San Jose State University, awarded in 1990.

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San Francisco, United States

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