Mike Smith is a Senior Vice President at Pacteon Group and the General Manager at Schneider Packaging Equipment. With a robust background in engineering and technology, they have previously held key positions at AMD, NVIDIA, and Arrow Electronics, including roles as CTO and VP. Mike was instrumental in developing growth strategies and technical expertise in various organizations, contributing significantly to the automation and packaging industries. Currently, they are active on the Fanuc Robotics Presidents Council and serve as a committee member at PMMI: The Association for Packaging and Processing Technologies. Mike holds an ongoing educational connection with Syracuse University.
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