Louis H.

Louis H. is a seasoned technology professional with a strong background in data engineering and data science, currently serving as a Senior Software Engineer for PayPay Corporation since February 2023, where contributions involve tackling large-scale data processing challenges. Previous experience includes roles as a Senior Data Platform Engineer at Tala and a Data Engineer at Fetch Rewards, focusing on data pipeline development and CI/CD practices. Louis has held managerial and engineering positions at Mindshare and ForwardLine Financial, where responsibilities included ML model deployment and data analysis. Academic qualifications feature a Master’s Degree in Financial Mathematics from UCLA and another Master’s Degree in Applied Physics from National Taiwan University, complemented by a Bachelor’s Degree in Physics and Mathematics from National Tsing Hua University.