Tomoya Maruyama is a Senior Data Engineer at PayPay Corporation, leading the data engineering team to design and implement high-performance data processing systems since October 2023. Previously, Tomoya worked at Amazon Web Services (AWS) in various roles, including Business Insights Analyst and Application Engineer/Sales Analyst, where data analysis and machine learning model development were key responsibilities. Tomoya's earlier experience includes serving as a Senior Software Engineer at LINE Corp, a System Engineer at F@N Communications, and roles in server and network engineering at multiple companies, including KOANKEISO CO., LTD. and SIC Inc. Tomoya holds a Master of Technology in Information System from the Advanced Institute of Industrial Technology and a Bachelor of Literature from St. Andrew's University.
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