道明 何 is a Senior Hardware Engineer at Peplink, specializing in Wi-Fi 6, Cellular, and CV2X module and AP router RF and EE design since 2020. Previously, they held roles as a Senior Engineer-RF at 仁寶 from 2011 to 2015, RF Specialist at 華碩 from 2015 to 2017, and RF Principal Engineer at 啟碁科技股份有限公司 from 2017 to 2020. 道明 earned a Bachelor's degree in Electrical Engineering from 中原大學 and a Master's degree from 國立臺北科技大學.
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