Lim Chong Siang is an expert in Chip-on-Board (COB) technology, specializing in advanced semiconductor manufacturing processes with a focus on the Besi Die Attach 2K2 system. They have honed their skills as a Senior NPI Process Engineer at Pepperl+Fuchs Group, where they lead technology work packages and integrate COB assemblies. With prior experience as a Process Engineer at ams AG and roles at Besi Singapore Pte Ltd, Besi APac, and Osram Opto Semiconductors, Lim has contributed to innovations in various high-performance applications across industries like automotive electronics and LED lighting. Lim holds a diploma and an advanced diploma in Robotics & Mechatronics Engineering and is currently pursuing a Professional Master in Business Administration and Management at UTM.
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