Evanna He, CPP, currently serves as a Packaging Engineer III at Philips since September 2022. Prior to this role, Evanna gained experience as a Packaging Engineer II at Network Partners Group from November 2021 to September 2022 and as a Packaging Engineer Intern at MedPlast Inc. from June 2017 to February 2018. Evanna holds a Bachelor's degree from Jinan University, obtained in 2015, and a Master's degree from Michigan State University, completed in 2017.
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