Jacco Scheer has extensive experience in the semiconductor industry, beginning as a Package & Assembly Development Engineer at Philips Applied Technologies from 1999 to 2006. Following this role, Jacco served as a Package & Assembly Reliability Engineer at NXP Semiconductors from February 2006 to July 2011, focusing on product release and quality optimization. Since then, Jacco has worked at Philips Innovation Services as an Industrial Project Leader from July 2011 to January 2024 and has been a Process Technologist at Philips since January 2017. Jacco holds a Master's degree in Applied Physics from Fontys University of Applied Sciences, earned between 1993 and 1998.
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