Oliver Kirsch

Oliver Kirsch is currently the Manager of Photonic Packaging Engineering at PHIX Photonics Assembly, where they lead the development and implementation of advanced photonic packaging solutions. Previously, Oliver served as a Team Leader in Photonic System Assembly at Fraunhofer IZM Berlin and was a Research Scientist focused on glass-based photonic integrated circuit technology. Their experience also includes roles as an RF & Optical Test Engineer at Sicoya GmbH, where they specialized in testing and characterizing photonic components, and as a Student Assistant at the same company. In addition, Oliver worked as a caregiver for severely physically disabled persons prior to pursuing a Master of Science in Physics from Technische Universität Berlin.