Fui do Tan

Fui Do Tan has experience in the engineering field, specifically in packaging and assembly. They first worked as a Packaging and Assembly Engineer at Renesas Electronics from July 2012 to June 2015, focusing on new product development. They then moved on to OSRAM, where they held the position of Senior Process Engineer from July 2015 to September 2017. Most recently, they joined Power Integrations in October 2017, initially as a Packaging and Assembly Engineer and later as a Senior Packaging and Assembly Engineer from May 2020.

Fui Do Tan attended Universiti Sains Malaysia from 2008 to 2012, where they pursued a Bachelor of Engineering degree in Materials Engineering.