Kunal Vyas is a Principal Technical Program Manager at Power Integrations and a Senior Manager of Product Engineering at TDK InvenSense, where they lead a team to deliver advanced MEMS-based IMUs and pressure sensors. With over 15 years of experience in the semiconductor industry, Kunal has a strong background in managing product engineering processes, ensuring quality control, and supporting Tier 1 customers in various sectors. They hold a Bachelor of Engineering in Electronics and Communications from Gujarat University and a Master's in ASIC/VLSI Design from San José State University. Passionate about problem-solving and process improvement, Kunal is committed to continuous learning and professional development.
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