Robert Daily is a seasoned semiconductor professional specializing in assembly and package engineering, currently serving as a Principal Engineer - Assembly and Packaging - R&D at Pragmatic since 2024. With a Bachelor of Science in Mechanical Engineering from Manuel S. Enverga University Foundation - Lucena, they have held various roles in the semiconductor industry, including Senior Principal Engineer at Rambus and Engineering Section Manager at Amkor Technology, Inc. Robert has extensive experience in areas such as FlipChip, 3DIC, and Failure Mode and Effects Analysis. Their career reflects a strong commitment to product development and process integration in advanced semiconductor technologies.
Location
United Kingdom
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