	State of the art Class 3 facility(all processes in house)
	Unparalleled up front engineering support
	Dual manufacturing availability(domestic/offshore)
	Inventory management
	24 hour protos, Variety of lead times as required
	Back drilling and via structures to minimize signal noise
	High-speed materials ,RF/microwave PCB’s
	Blind and buried via technology
	Via in pad technology (copper filled and epoxy filled microvias) Complex microvia structures 
	Differential impedance
	Thermal management solutions, Aluminum or copper heatsink
	Heavy copper ,High aspect ratio plating
	Flex (up to 12 layer) and Rigid-Flex (up to 18 layer) Rigid PCB’s(up to 34 layer)
	ITAR Certified, MBE Certified, SDB 
	Rogers complete series, Taconic, Arlon, Nelco, Megtron, Tachyon, ISOLA, Nelco, Teflon, etc.,

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