Chiling H.

Chiling H. is an experienced quality engineer with a strong background in supplier quality management and process quality within the semiconductor industry. Chiling H. served as a Customer Quality Engineer at 艾克爾國際科技股份有限公司 from September 2017 to March 2020, focusing on wafer bumping process quality and supporting IC design customers. Following this role, Chiling H. advanced to a Senior Supplier Quality and Reliability Engineer at 英特爾 from December 2020 to October 2025, where responsibilities included initiating quality programs and managing PCBA supplier quality. Chiling H.'s career continued as a Back End Central Quality Assurance Engineer at 美光科技 in 2020, applying 8D problem-solving methodologies, and currently serves as a Staff Engineer in Supplier Quality at pSemi, overseeing end-to-end supplier quality management. Chiling H. holds a master's degree in Chemistry from 國立清華大學 and a bachelor's degree in Chemistry from 國立中山大學.