Guy Smith possesses extensive engineering experience, currently serving as Senior Manager of Packaging and PCB at pSemi, A Murata Company since March 2022. Concurrently, Guy also holds the position of Principal Mechanical Engineer at Collins Aerospace since December 2018, specializing in hardware design tools architecture. Additionally, Guy has been a Principal Microelectronics Packaging Engineer at Skyworks Solutions, Inc. since June 2013 and previously worked as a Principal Mechanical Engineer at Rockwell Collins from August 1997 to June 2013. Guy Smith earned two Bachelor of Science degrees in Engineering and Mechanical Engineering from Iowa State University, completing studies from 1995 to 2000.
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