Joey Salta is a Semiconductor Packaging Engineer with a PhD and extensive experience in packaging and assembly technology development, as well as physical device failure analysis. Currently serving as a Senior Staff Engineer at pSemi, a Murata Company, Joey has previously held various engineering roles at organizations including Skyworks Solutions, NXP Semiconductors, and Intel Technology. Joey specializes in wire bond and flip-chip assembly technologies, as well as advanced analysis techniques such as SEM and EDS. Their work spans industries from aerospace to defense, focusing on ensuring device reliability and manufacturability.
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