Chen-Ling Lai holds both a Master of Science and a Bachelor of Science in Mechanical Engineering from National Taiwan University and Texas A&M University. With over 7.5 years of research experience and varied roles in the manufacturing and automation industries, they have developed a strong expertise in production, operation, and quality. Chen-Ling began their career in DuPont CMP technologies in 2018 and has since contributed to significant advancements in customer engagement and business growth. Currently, as an Account Director for Advanced Packaging Technologies at DuPont, they focus on building long-term partnerships with top semiconductor foundries.
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