Chi-Hung (Ryan) Lin is a Global Application Technology Leader in Laminates at Qnity, a position held since 2025. Previously, Ryan worked at 台灣杜邦股份有限公司, where Ryan held multiple roles, including Application Technology Leader and Advanced Interconnect Technology Team Leader. Ryan earned a Master's degree in Chemical Engineering from 國立臺灣大學 in 2009, following a Bachelor's degree in the same field from the same institution in 2007. Earlier in their career, Ryan served as an RD Engineer at NAN YA PRINTED CIRCUIT BOARD CORPORATION from 2009 to 2013.
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