William Bryson

William Bryson, CID, has over 40 years of experience in PCB design and engineering. Currently serving as a Senior CAE Engineer at Qorvo, Inc. since January 2015, William previously held senior engineering positions at RFMD and HTC America Innovation, Inc., where expertise in advanced routing techniques and board materials for rigid, flex, and rigid-flex designs was showcased. From June 2000 to June 2010, William worked as a Senior PCB CAD Engineer at Sony Ericsson, and prior to that, served as a Senior PCB Designer at General Dynamics, where responsibilities included reviewing engineering data, collaborating with electrical engineers, and overseeing the design feasibility throughout the PCB fabrication process. William holds an Associate of Applied Science degree in Mechanical Drafting & Design Technology from Alamance Community College.