Bruce Smith

Bruce Smith is a seasoned engineer with extensive experience in test engineering and product development within the semiconductor industry. Currently serving as a Sr. Staff Engineer at NXP Semiconductors since July 2018 and a Staff Engineer at Qualcomm since September 2015, Bruce specializes in developing test programs, product bring-up, and cost-improvement initiatives while enhancing factory operations. Prior roles include Principal Engineer at Conexant Systems/Ikanos Communications, where responsibilities encompassed ATE test development for SoC chips, and a series of positions at AT&T Microelectronics/Bell Laboratories, focusing on development and manufacturing of various ICs. Bruce holds a Bachelor's Degree in Electrical Engineering Technology from The Pennsylvania State University and an Associate's Degree from Penn State Altoona.